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Manufacturing of 10 layer high-frequency PCB circuit board

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10-layer high-frequency PCBs use Rogers material. With 1OZ copper, fine trace width/spacing (0.35mm/0.2mm), and ENIG surface treatment, they deliver exceptional RF performance, ideal for demanding wireless communication and radar systems.
Material Rogers (a type of high-frequency laminate material)
Number of Layers 10 layers
Copper Thickness 1OZ
Board Thickness 1.8mm
Minimum Trace Width/Spacing 0.35mm/0.2mm
Manufacturing Process Lamination pressing
Minimum Aperture 0.3mm
Surface Treatment Immersion Gold (ENIG - Electroless Nickel Immersion Gold)
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  • Type:
    SMT PCB assembly: 20 million points/day
    PCB manufacturing: 80,000 m²/month
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  • Manufacturing of 10 layer high-frequency PCB circuit board
  • Manufacturing of 10 layer high-frequency PCB circuit board
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  • Manufacturing of 10 layer high-frequency PCB circuit board
  • Description

In the realm of high - frequency electronic applications, such as advanced wireless communication, radar systems, and satellite technology, the performance of the printed circuit board (PCB) is of utmost importance. Our 10 - layer high - frequency PCBs, crafted using Rogers high - frequency laminate material, are specifically engineered to meet the rigorous demands of these applications.

Rogers material is renowned for its excellent electrical properties, including low dielectric loss, stable dielectric constant over a wide frequency range, and high signal - to - noise ratio. These characteristics make it an ideal choice for high - frequency signal transmission, minimizing signal attenuation and distortion.

The 10 - layer structure of the PCB provides ample space for complex circuit designs, enabling the integration of multiple high - frequency components and functions on a single board. The 1OZ copper thickness is carefully selected to balance electrical conductivity and mechanical stability, ensuring efficient power and signal transfer while maintaining the structural integrity of the board.

With a board thickness of 1.8mm, the PCB offers sufficient rigidity to withstand mechanical stresses during handling and operation. The manufacturing process of lamination pressing ensures uniform layer bonding, reducing the risk of delamination and improving the overall reliability of the PCB.

The minimum trace width of 0.35mm and minimum trace spacing of 0.2mm allow for high - density circuit layouts, facilitating the miniaturization of the PCB without sacrificing performance. The minimum aperture of 0.3mm enables precise via formation, which is crucial for maintaining signal integrity in high - frequency circuits.

The Immersion Gold (ENIG - Electroless Nickel Immersion Gold) surface treatment provides excellent corrosion resistance and solderability, ensuring reliable electrical connections and long - term stability of the PCB in various operating environments.

For high - quality 10 - layer Rogers high - frequency PCBs, contact us at yuan@shwaypcb.com.

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