HDI board(High-Density Interconnect PCBs)
Explore hdi board(high-density interconnect pcbs) requirements and review related PCB manufacturing and assembly capabilities.
PRODUCT GALLERY
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Detailed Technical Parameters
Comprehensive technical specifications to meet various application needs from consumer electronics to aerospace
| Project | Standard capabilities | Advanced abilities | Remark |
|---|---|---|---|
| Number of layers | 2-16 layers | 18-98 layers | Supports blind and buried vias, and arbitrary layer interconnection. |
| Board thickness range | 0.2-3.2mm | 0.1-12.0mm | Tolerance: ±10% |
| Minimum line width/spacing | 3/3mil (0.075mm) | 2/2mil (0.05mm) | Direct laser imaging |
| Minimum aperture | 0.2mm mechanical drilling | 0.1mm laser micro-hole | Aspect ratio: 20:1 |
| Impedance control | ±10% | ±3Ω | Single-ended/differential impedance |
| Surface treatment | Lead-containing/lead-free solder plating, immersion gold | Immersion silver, immersion tin, OSP, electroplated hard gold | RoHS compliant |
| Copper thickness range | 0.5-2.0oz | 3.0-12.0oz | Thick copper plate |
| Warpage control | ≤0.75% | ≤0.3% | High-precision pressing process |
GETTING STARTED
Information to include with your request
Providing the available details below helps the team understand what you need. Only share information you are authorized to provide.
- The capability area you would like to discuss
- Relevant design or production files, where available
- Target quantity, schedule, and quality expectations
- Your contact details for a manufacturing review
PROJECT CONTACT
Discuss your requirements with ShwayPCB
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