High-Density SMT Assembly
Explore high-density smt assembly requirements and review related PCB manufacturing and assembly capabilities.
PRODUCT GALLERY
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Reference images illustrate related products and processes. Your supplied design, model and configuration will be confirmed for your project.
Detailed Technical Parameters
Comprehensive technical specifications to meet various application needs from consumer electronics to aerospace
| Project | Standard capabilities | Advanced abilities | Remark |
|---|---|---|---|
| Component type | 0201, 0.4mm QFP | 01005, 0.2mm BGA/QFN | Supports special-shaped components |
| Placement accuracy | ±25μm @ 3σ | ±15μm @ 3σ | Fuji NXT III platform |
| Solder paste printing | ±15μm repeat accuracy | ±10μm repeat accuracy | DEK Horizon printer |
| Reflow soldering | 8-zone lead-free reflow oven | 10-zone nitrogen protection | Precise temperature profile control |
| Inspection capability | 2D AOI, ICT | 3D AXI, FCT, flying probe test | Full-process quality control |
| Soldering standard | IPC-A-610 Class 2 | IPC-A-610 Class 3 | Military/Medical grade standard |
| Cleaning process | Aqueous cleaning | Plasma cleaning | High reliability requirements |
| Conformal coating | Acrylic coating | Polyurethane/Silicone coating | Selective coating process |
GETTING STARTED
Information to include with your request
Providing the available details below helps the team understand what you need. Only share information you are authorized to provide.
- The capability area you would like to discuss
- Relevant design or production files, where available
- Target quantity, schedule, and quality expectations
- Your contact details for a manufacturing review
PROJECT CONTACT
Discuss your requirements with ShwayPCB
Send your project information directly to our team, contact us on WhatsApp, or prepare a quote request for your own records before getting in touch.