Capacity
Explore capacity requirements and review related PCB manufacturing and assembly capabilities.
PRODUCT GALLERY
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Reference images illustrate related products and processes. Your supplied design, model and configuration will be confirmed for your project.
Detailed Technical Parameters
Comprehensive technical specifications to meet various application needs from consumer electronics to aerospace
| Project | Standard capabilities | Advanced abilities | Remark |
|---|---|---|---|
| Number of layers | 2-16 layers | 18-98 layers | Supports blind and buried vias, and arbitrary layer interconnection. |
| Board thickness range | 0.2-3.2mm | 0.1-12.0mm | Tolerance: ±10% |
| Minimum line width/spacing | 3/3mil (0.075mm) | 2/2mil (0.05mm) | Direct laser imaging |
| Minimum aperture | 0.2mm mechanical drilling | 0.1mm laser micro-hole | Aspect ratio: 20:1 |
| Impedance control | ±10% | ±3Ω | Single-ended/differential impedance |
| Surface treatment | Lead-containing/lead-free solder plating, immersion gold | Immersion silver, immersion tin, OSP, electroplated hard gold | RoHS compliant |
| Copper thickness range | 0.5-2.0oz | 3.0-12.0oz | Thick copper plate |
| Warpage control | ≤0.75% | ≤0.3% | High-precision pressing process |
GETTING STARTED
Information to include with your request
Providing the available details below helps the team understand what you need. Only share information you are authorized to provide.
- The capability area you would like to discuss
- Relevant design or production files, where available
- Target quantity, schedule, and quality expectations
- Your contact details for a manufacturing review
PROJECT CONTACT
Discuss your requirements with ShwayPCB
Send your project information directly to our team, contact us on WhatsApp, or prepare a quote request for your own records before getting in touch.