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Home > All Products > Multilayer PCB > 4-layer Rogers 5880 high-frequency PCB board manufacturing

4-layer Rogers 5880 high-frequency PCB board manufacturing

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4-layer Rogers 5880 PCBs feature ultra-low dielectric loss (0.0037) and Taconic-grade high-frequency performance. With 0.35mm/0.2mm trace/spacing, 0.3mm via, and ENIG finish, they ensure stable signal integrity for demanding RF applications.
Material Rogers 5880
Number of Layers 4 layers
Dielectric Loss Tangent 0.0037
Substrate Thickness 0.8 ± 0.1 MM
Minimum Trace Width/Spacing 0.35mm/0.2mm
Process Feature Taconic High - Frequency Material
Minimum Drill Diameter 0.3mm
Surface Finish Immersion Gold
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  • Type:
    SMT PCB assembly: 20 million points/day
    PCB manufacturing: 80,000 m²/month
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  • 4-layer Rogers 5880 high-frequency PCB board manufacturing
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  • 4-layer Rogers 5880 high-frequency PCB board manufacturing
  • Description
In the rapidly evolving field of high-frequency electronics, where signal integrity and low loss are paramount, our 4-layer Rogers 5880 PCBs stand out as a premier solution. Engineered for applications requiring precise RF performance, these PCBs leverage the exceptional properties of Rogers 5880 material, which boasts a dielectric loss tangent of just 0.0037—ensuring minimal signal attenuation and distortion even at elevated frequencies.

The 4-layer structure provides a balanced combination of electrical performance and mechanical stability. Rogers 5880, a Taconic-grade high-frequency laminate, offers stable dielectric constant and low loss across a wide frequency range, making it ideal for wireless communication systems, radar modules, satellite transceivers, and 5G infrastructure. The substrate thickness of 0.8±0.1mm ensures structural rigidity while maintaining compatibility with compact device designs.

With a minimum trace width of 0.35mm and spacing of 0.2mm, the PCB supports high-density circuit layouts, enabling the integration of complex RF components without compromising signal quality. The minimum drill diameter of 0.3mm ensures precise via formation, critical for maintaining impedance control and minimizing crosstalk in high-speed circuits.

The lamination pressing process guarantees uniform layer bonding, reducing the risk of delamination and enhancing long-term reliability. Surface finish with Immersion Gold (ENIG) provides excellent corrosion resistance and solderability, ensuring robust electrical connections and durability in harsh operating environments.

Industry Applications:
  • Wireless communication systems (5G base stations, IoT devices)
  • Radar and satellite transceivers
  • Aerospace and defense electronics
  • High-speed data transmission modules
For high-quality 4-layer Rogers 5880 high-frequency PCBs, contact us at yuan@shwaypcb.com.

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