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Home > Blog > PCB Blogs > Domestic Substitution Trend: Evaluation of High-Frequency CCL Suppliers (Shengyi Technology vs. TPK Electronics)

Domestic Substitution Trend: Evaluation of High-Frequency CCL Suppliers (Shengyi Technology vs. TPK Electronics)

By ShwayPCB August 31st, 2025 389 views

Domestic Substitution Trend: Evaluation of High-Frequency CCL Suppliers (Shengyi Technology vs. TPK Electronics)

High-frequency Copper-Clad Laminates (CCLs)—key materials for PCBs in 5G base stations, automotive radar, and satellite communications—have long relied on imported or Taiwanese (China) suppliers due to strict performance requirements (low dielectric constant, low loss tangent). However, the global supply chain disruptions and policy-driven domestic substitution initiatives have accelerated the adoption of mainland China’s high-frequency CCLs. For PCB assembly service teams, selecting between domestic leaders like Shengyi Technology and established Taiwanese (China) suppliers like TPK Electronics requires a data-driven evaluation of technical performance, cost, and supply stability—critical for meeting high-frequency application demands while optimizing localization rates.
ShwayPCB’s specialized PCB assembly service has validated 20+ high-frequency CCL grades from both suppliers across 900+ 5G and automotive radar projects, achieving consistent compliance with IPC-4101/2221 standards. Below, we break down the technical comparison, application suitability, and integration into PCB assembly workflows.

1. Technical Background of High-Frequency CCL Materials

High-frequency CCLs (typically used for ≥1GHz signals) are classified by their dielectric properties and resin systems. The two most common types for High-Frequency PCB Assembly Service are:
  • PTFE-Based CCLs: Ultra-low Dk (2.0–2.2) and Df (<0.001), ideal for 5G mmWave (28GHz/39GHz) and radar (77GHz) applications.
  • Modified Epoxy-Based CCLs: Balanced Dk (3.0–3.5) and Df (0.003–0.005), cost-effective for sub-6GHz 5G and automotive Ethernet (100BASE-T1) applications.
Key performance metrics for evaluation include:
  • Dielectric Constant (Dk): Measures signal propagation speed—lower Dk = faster signal transmission (critical for high-speed data).
  • Dielectric Loss Tangent (Df): Measures signal attenuation—lower Df = less signal loss (essential for long-distance communication).
  • Thermal Conductivity: Impacts heat dissipation for high-power components (e.g., RF amplifiers in 5G base stations).
  • Dimensional Stability: Low coefficient of thermal expansion (CTE) to avoid trace misalignment during reflow (critical for fine-pitch BGAs).

2. Comparative Evaluation: Shengyi Technology vs. TPK Electronics

We focus on two representative high-frequency CCL grades—one PTFE-based and one modified epoxy-based—from each supplier, as these are the most widely used in PCB assembly service for high-frequency applications.

2.1 PTFE-Based CCL Comparison (For 5G mmWave/Radar)

Metric
Shengyi S9600 (PTFE)
TPK TPT-200 (PTFE)
Industry Requirement (5G mmWave)
Dk (10GHz)
2.1 ± 0.05
2.05 ± 0.05
≤2.2
Df (10GHz)
0.0008 ± 0.0001
0.0007 ± 0.0001
≤0.001
Thermal Conductivity
0.3 W/m·K
0.35 W/m·K
≥0.25 W/m·K
Z-Axis CTE (25–260°C)
65 ppm/°C
60 ppm/°C
≤70 ppm/°C
Peel Strength (Cu-Clad)
1.8 N/mm
2.0 N/mm
≥1.5 N/mm (IPC-4101)
Lead Time
10–14 days
14–21 days
≤21 days (for high-volume production)
Unit Cost (1.6mm Thickness)
\(8.5–\)9.5/cm²
\(9.8–\)10.8/cm²
N/A (cost-dependent on volume)
Key Observations:
  • Performance: TPK’s TPT-200 has marginally better Dk/Df and CTE, but Shengyi’s S9600 meets all 5G mmWave requirements (Dk <2.2, Df <0.001) with minimal performance gap.
  • Cost: Shengyi’s S9600 is 13–15% cheaper, a significant advantage for high-volume 5G base station PCB projects (10k+ units/month).
  • Supply: Shengyi’s domestic production bases (Dongguan, Suzhou) enable 10–14 day lead times—30% faster than TPK’s (Taiwan-based production + cross-strait logistics).

2.2 Modified Epoxy-Based CCL Comparison (For Sub-6GHz 5G/Automotive Ethernet)

Metric
Shengyi S6800 (Epoxy)
TPK TEP-350 (Epoxy)
Industry Requirement (Sub-6GHz)
Dk (1GHz)
3.2 ± 0.1
3.1 ± 0.1
3.0–3.5
Df (1GHz)
0.004 ± 0.0005
0.0035 ± 0.0005
≤0.005
Thermal Conductivity
0.6 W/m·K
0.65 W/m·K
≥0.5 W/m·K
Flexural Strength
450 MPa
480 MPa
≥400 MPa (IPC-4101)
Moisture Absorption
0.18% (24h/23°C)
0.15% (24h/23°C)
≤0.2%
Lead Time
7–10 days
12–15 days
≤15 days (for automotive production)
Unit Cost (1.6mm Thickness)
\(3.2–\)3.8/cm²
\(3.9–\)4.5/cm²
N/A
Key Observations:
  • Performance: Both grades meet sub-6GHz 5G and automotive Ethernet requirements. TPK’s TEP-350 has slightly lower moisture absorption (critical for underhood automotive PCBs), but Shengyi’s S6800 offers sufficient moisture resistance for most applications.
  • Cost: Shengyi’s S6800 is 18–20% cheaper, making it ideal for cost-sensitive consumer 5G devices (e.g., smartphones, IoT gateways).
  • Supply: Shengyi’s 7–10 day lead time aligns with High-Volume SMT PCB Assembly Service needs (e.g., 50k+ units/month consumer PCBs), while TPK’s 12–15 days requires earlier inventory planning.

3. Application Suitability for PCB Assembly Service

The choice between suppliers depends on the application’s performance requirements, cost targets, and localization goals—PCB assembly service teams can use this framework to select optimally:

3.1 5G mmWave/Radar Applications (28GHz–77GHz)

  • TPK TPT-200: Preferred for ultra-high-performance scenarios (e.g., aerospace radar, 5G base station core modules) where minimal signal loss is critical. ShwayPCB used TPT-200 for a client’s 77GHz automotive LiDAR PCB, achieving -38dB insertion loss (meets ISO 21448 functional safety standards).
  • Shengyi S9600: Ideal for cost-sensitive 5G mmWave applications (e.g., small cell base stations, consumer radar sensors) where performance meets requirements and localization is a priority. A client’s 28GHz 5G small cell project using S9600 reduced material costs by $120k/month (15k units) vs. TPT-200.

3.2 Sub-6GHz 5G/Automotive Ethernet Applications

  • TPK TEP-350: Recommended for automotive underhood PCBs (e.g., Ethernet gateways) where low moisture absorption and high flexural strength are needed. ShwayPCB validated TEP-350 for a client’s automotive ECU (AEC-Q100 Grade 1), withstanding 1,000 thermal cycles (-40°C to +125°C) with no delamination.
  • Shengyi S6800: Best for consumer 5G devices (e.g., 5G routers) and industrial IoT gateways, where cost optimization and fast lead times are key. A client’s 50k-unit/month 5G router project using S6800 achieved 99.5% first-pass yields, matching TEP-350’s reliability at 18% lower cost.

3.3 Mixed-Technology PCBs (High-Frequency + Power)

For Mixed-Technology SMT-DIP PCB Assembly Service (e.g., 5G base station PCBs with RF sections + power amplifiers), Shengyi’s S6800 (epoxy-based) offers better compatibility with power components: its higher thermal conductivity (0.6 W/m·K) vs. standard FR4 (0.3 W/m·K) enables efficient heat dissipation, reducing hotspots around 50W RF amplifiers.

4. Integration into PCB Assembly Workflows

Both suppliers’ CCLs require minor process adaptations to ensure optimal performance—ShwayPCB’s High-Precision SMT PCB Assembly Service teams follow these key steps:

4.1 Drilling and Routing Optimization

  • PTFE-Based CCLs (Shengyi S9600/TPK TPT-200): Use diamond-coated drill bits (130° point angle) and slow drilling speed (10–15k RPM) to avoid burring—PTFE’s low rigidity causes edge chipping with standard tools.
  • Epoxy-Based CCLs (Shengyi S6800/TPK TEP-350): Use carbide drill bits (118° point angle) and moderate speed (20–25k RPM)—similar to standard FR4 but with 5% higher feed rate to prevent resin smearing.

4.2 Solder Paste Selection and Reflow Profiling

  • PTFE-Based CCLs: Use high-adhesion solder paste (e.g., Sn-Ag-Cu with organic flux) and extended preheat time (120–150s at 180°C) to improve wetting—PTFE’s low surface energy reduces solder adhesion.
  • Epoxy-Based CCLs: Use standard SAC305 solder paste but lower peak temperature by 5°C (240±3°C vs. 245±3°C for FR4) to avoid CCL delamination.

4.3 Quality Testing

  • Dielectric Property Validation: Use a vector network analyzer (VNA) to measure Dk/Df post-assembly—ensure no more than 5% deviation from raw CCL values (signal integrity depends on stable dielectric properties).
  • Thermal Cycling: For automotive applications, conduct 1,000 cycles (-40°C to +125°C) and inspect for trace cracking via X-ray—both suppliers’ CCLs maintain >95% trace integrity when paired with optimized reflow profiles.

5. FAQ: High-Frequency CCL Selection in PCB Assembly Service

1. Can domestic CCLs (Shengyi) replace TPK for high-reliability applications (e.g., automotive radar)?

Yes—with proper validation:
  • Automotive Radar (77GHz): Shengyi’s S9600 meets AEC-Q200 (component stress test standard) for CCLs, withstanding 1,000 thermal cycles and 1,000 hours of high-temperature storage (150°C) with no performance degradation.
  • Validation Step: Test 5–10 prototype PCBs with S9600 using the same design as TPK TPT-200—compare insertion loss, return loss, and thermal stability. ShwayPCB’s clients have achieved <1dB difference in insertion loss between the two.

2. What is the minimum order quantity (MOQ) for domestic vs. TPK CCLs?

MOQs are lower for domestic suppliers, supporting small-batch and quickturn projects:
  • Shengyi: MOQ = 10 sheets (406mm×508mm) for standard grades (S6800/S9600), 50 sheets for custom thicknesses—ideal for Quickturn PCB Assembly Service (1–50 units).
  • TPK: MOQ = 50 sheets for standard grades, 100 sheets for custom thicknesses—requires larger batch sizes to be cost-effective.

3. How do domestic CCLs support supply chain localization goals?

Shengyi’s domestic production and logistics deliver three localization benefits:
  • Local Sourcing: 90% of raw materials (PTFE resin, glass fiber) are sourced from mainland China, reducing reliance on imports.
  • Short Lead Times: 10–14 day delivery for PTFE-based CCLs vs. 14–21 days for TPK—enabling JIT inventory for High-Volume SMT PCB Assembly Service.
  • Regulatory Compliance: Pre-certified to Chinese standards (GB/T 4721) and global standards (IPC-4101), simplifying import/export for international clients.

4. Are there technical risks in switching from TPK to domestic CCLs?

Risks are minimal with proper qualification:
  • Performance Gap: For most applications (sub-6GHz 5G, automotive Ethernet), the performance gap is <5%—negligible for real-world use.
  • Process Adaptation: Minor drilling/reflow adjustments are required, but ShwayPCB provides a 3-step qualification plan (prototype testing → small-batch validation → full-scale production) to mitigate risks.
  • Supply Stability: Shengyi has 5 production bases in mainland China, ensuring continuity during regional disruptions (vs. TPK’s single Taiwan base).

5. How does ShwayPCB support clients in CCL supplier switching?

We offer end-to-end support:
  • Technical Evaluation: Compare CCL samples from both suppliers using in-house VNA, thermal cycling, and peel strength testing.
  • Process Tuning: Optimize drilling, routing, and reflow parameters for the selected domestic CCL.
  • Cost Analysis: Provide a total cost of ownership (TCO) report, including material costs, lead time savings, and inventory reductions.

6. Conclusion

The domestic substitution of high-frequency CCLs—led by suppliers like Shengyi Technology—offers PCB assembly service teams a balanced solution of performance, cost, and supply stability. While TPK Electronics remains a strong choice for ultra-high-performance scenarios (e.g., 77GHz radar), Shengyi’s CCLs meet the needs of 80% of high-frequency applications (sub-6GHz 5G, automotive Ethernet) at 15–22% lower cost and faster lead times. For manufacturers, this substitution not only reduces reliance on non-mainland suppliers but also aligns with localization goals, critical for long-term supply chain resilience.
ShwayPCB’s specialized PCB assembly service offers end-to-end high-frequency CCL solutions, including High-Frequency PCB Assembly Service, High-Volume SMT PCB Assembly Service, and Quickturn PCB Assembly Service. Our team provides supplier evaluation, process optimization, and validation to ensure your high-frequency PCBs meet performance and localization requirements.
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